Last updated : 04/01/2020
Tulip Co., Ltd.
- President
- Kotaro HARADA (Mr.)
- Year established
- 1948
- Capital
- 10,500,000 yen
- Employees
- 45
- Postal (zip) code
- 733-0002
- Company address
- 4-19-8 Kusunoki-cho, Nishi-ku, Hiroshima-shi
- Phone
- 082-238-1144
- Fax
- 082-238-5358
- E-Mail
- info@tulip-japan.co.jp
- URL
- http://www.tulip-japan.co.jp
Company PR
A manufacturer of needles for hand sewing, marking pins, and crochets for lace knitting. After developing the production technology needed to produce inspection probes for printed circuit boards, in recent years we have seen the results as an increase in orders for test probes to be used on bare boards and mounted circuit boards. Our Kake Plant is a JIS (Japanese Industrial Standards) certified plant permitted to use the JIS mark on the products.
Major Products
- Lace crochets: 0.4 mm - 6.5 mm
- Needles for hand sewing: JIS approved products, approved to indicate the JIS mark on the products
- Contact probe: Hi-spin
- Test probes for bare boards
- Vertical type wire probes: 0.07 mm - 0.15, 0.3 mm
Major Facilities/Equipment
- Straight cutting machine 12
Machine to cut piano wires and hard steel wires after recoiling and straightening them
- Needle point grinding machine 50
Grinds poles and wire rods of 0.5 mm - 4.0 mm on bonded abrasive. Can handle grinding of 0.2 mm rods minimum.
- Press 20
Cold pressing of 1 t - 80 t. Automatic transfer.
- Electric furnace 3
Quenching and tempering furnace, anti-oxidation quenching induction hardening.
- Electric discharge machine 1
Die fabrication. Worked in-house
Technology Employed
- Other manufacturing industry
- Can handle 0.07 - 6.0 mm metal materials, from needles for hand sewing to fine probes.
- Other manufacturing industry
- Tapering by bonded abrasive to 0.5 mm - 4.5 mm with chamfering.
- Other manufacturing industry
- Can polish to 0.1 mm - 4.5 mm. Surface polishing by barrel polishing and drill point processing machining.
- Other manufacturing industry
- Nickel plating. Automated line. 0.5 - 3.0 mm.
- Other manufacturing industry
- Ni - P, Ni - B, boron plating. Capable of handling 0.2 - 2.0 mm.
- Other manufacturing industry
- Anti-oxidation quenching and tempering technology: 0.2 - 3.0 mm.
- Other manufacturing industry
- Drill point processing through barrel polishing, wet/dry spheroidizing.
- Other manufacturing industry
- Wire probe made from high speed steel. Capable of handling 0.1 mm - 0.3 mm. For inspection of printed circuit boards. R&D.
- Other manufacturing industry
- Material and basic processing of probes for inspection of printed circuit boards.
Primary Area of Technical Expertise
Based on the technology for manufacturing needles, offering straight cutting, stamping, quenching and grinding of extra-fine wires (coiled wires and wire rods) on a mass-production basis. Currently developing a highly cost effective vertical probe pointing and grinding high speed steel.
Future Business Challenges
- Development of a vertical probe of 0.05 - 0.15 mm as an ultra-fine wire probe.
- Development of inspection probes for printed circuit boards.
Future Technical Challenges
- Other manufacturing industry
- Development of extra-fine test probes of 0.07 - 0.15 mm for printed circuit boards.
- Other manufacturing industry
- Vertical probes, fine pitch boards, probes of 0.07 mm - 0.15 mm for the inspection of semiconductors.
