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Tulip Co., Ltd.

製造業

President
Kotaro HARADA (Mr.)
Year established
1948
Capital
10,500,000 yen
Employees
45
Postal (zip) code
733-0002
Company address
4-19-8 Kusunoki-cho, Nishi-ku, Hiroshima-shi
Phone
082-238-1144
Fax
082-238-5358
E-Mail
info@tulip-japan.co.jp
URL
http://www.tulip-japan.co.jp
Company PR
A manufacturer of needles for hand sewing, marking pins, and crochets for lace knitting. After developing the production technology needed to produce inspection probes for printed circuit boards, in recent years we have seen the results as an increase in orders for test probes to be used on bare boards and mounted circuit boards. Our Kake Plant is a JIS (Japanese Industrial Standards) certified plant permitted to use the JIS mark on the products.
Major Products
Lace crochets: 0.4 mm - 6.5 mm
Needles for hand sewing: JIS approved products, approved to indicate the JIS mark on the products
Contact probe: Hi-spin
Test probes for bare boards
Vertical type wire probes: 0.07 mm - 0.15, 0.3 mm
Major Facilities/Equipment
Straight cutting machine 12
 Machine to cut piano wires and hard steel wires after recoiling and straightening them
Needle point grinding machine 50
 Grinds poles and wire rods of 0.5 mm - 4.0 mm on bonded abrasive. Can handle grinding of 0.2 mm rods minimum.
Press 20
 Cold pressing of 1 t - 80 t. Automatic transfer.
Electric furnace 3
 Quenching and tempering furnace, anti-oxidation quenching induction hardening.
Electric discharge machine 1
 Die fabrication. Worked in-house
Technology Employed
Other manufacturing industry
Can handle 0.07 - 6.0 mm metal materials, from needles for hand sewing to fine probes.
Other manufacturing industry
Tapering by bonded abrasive to 0.5 mm - 4.5 mm with chamfering.
Other manufacturing industry
Can polish to 0.1 mm - 4.5 mm. Surface polishing by barrel polishing and drill point processing machining.
Other manufacturing industry
Nickel plating. Automated line. 0.5 - 3.0 mm.
Other manufacturing industry
Ni - P, Ni - B, boron plating. Capable of handling 0.2 - 2.0 mm.
Other manufacturing industry
Anti-oxidation quenching and tempering technology: 0.2 - 3.0 mm.
Other manufacturing industry
Drill point processing through barrel polishing, wet/dry spheroidizing.
Other manufacturing industry
Wire probe made from high speed steel. Capable of handling 0.1 mm - 0.3 mm. For inspection of printed circuit boards. R&D.
Other manufacturing industry
Material and basic processing of probes for inspection of printed circuit boards.
Primary Area of Technical Expertise

Based on the technology for manufacturing needles, offering straight cutting, stamping, quenching and grinding of extra-fine wires (coiled wires and wire rods) on a mass-production basis. Currently developing a highly cost effective vertical probe pointing and grinding high speed steel.

Future Business Challenges
Development of a vertical probe of 0.05 - 0.15 mm as an ultra-fine wire probe.
Development of inspection probes for printed circuit boards.
Future Technical Challenges
Other manufacturing industry
Development of extra-fine test probes of 0.07 - 0.15 mm for printed circuit boards.
Other manufacturing industry
Vertical probes, fine pitch boards, probes of 0.07 mm - 0.15 mm for the inspection of semiconductors.
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